SYNTECS | Complex shaped copper vapour chamber (VC)
SYNTECS will use LST to match and improve the cooling efficiency achieved by sintered wick
VCs (by up to 48%) by enabling enhanced water/vapour transport and evaporation. The
multi-axis SYNTECS machine will enable texturing on internal surfaces of top and bottom
plates which have complex geometries in the X, Y and Z planes.
DLW will be used to produce 50-200 μm grooves on the plates, with aspect ratios (3-5) that
could not be achieved by mechanical methods.
These grooves will support long-range capillary
action to pull water around the system. DLIP (10-20 μm) and LIPSS (100-200 nm)
hierarchical
texturing on top of the grooved structure will promote tangential transport of water
between
the grooves and give a larger surface area for evaporation.
The use of USP burst mode will be used to enhance ablation efficiency (to >5 μm3/μJ, 10x
enhancement vs single pulse USP processing) to bring the process in line with industrial
expectations for the production of ~5M VCs/ year.